Plasma Analysis Software - List of Manufacturers, Suppliers, Companies and Products

Plasma Analysis Software Product List

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Particle-based Plasma Analysis Software 'Particle-PLUS'

"Particle-PLUS" is a plasma analysis software suitable for simulations such as plasma reaction furnaces and chemical vapor deposition (CVD).

Particle-PLUS is plasma and rarefied fluid analysis software that uses the particle method. It is effective for research, development, and manufacturing of devices and materials using plasma. It is also capable of analyzing advanced physical models such as dual-frequency CCP and external circuit models. With comprehensive support, even those new to simulation or busy with experiments can reliably achieve results. The software employs a particle model to analyze plasma, utilizing the PIC/MC (Particle In Cell / Monte Carlo) method to track the motion of particles representing electrons and ions. Depending on the target plasma density, it efficiently switches between implicit methods for relatively high densities and explicit methods for low densities, allowing for effective solutions even for complex models. It excels in plasma simulations of low-pressure gases, where fluid modeling is particularly challenging. In addition to standard functions for CCP, ICP, and magnetron sputtering calculations, customization to fit customer devices is also available.

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High-speed general-purpose plasma analysis software 'VizGlow'

This software was developed by Professor Raja, an expert in plasma simulation at the University of Texas at Austin.

VizGlow is a general-purpose plasma simulation software developed by Esgee Technologies, Inc., founded by Professor Raja from the University of Texas at Austin, an expert in plasma simulation.

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[Case] 'Particle-PLUS' RF Magnetron Sputtering

An example of the 'Particle-PLUS' analysis of RF magnetron sputtering, which is one of the film formation methods for dielectric films using process plasma.

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in plasma analysis within vacuum chambers and can perform simulations of film deposition rates at high speed. - It excels in low-pressure plasma analysis. - It is proficient in plasma simulations in low-pressure gases, where calculations using fluid models are challenging. - It supports 2D and 3D, allowing for efficient analysis even with complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitive coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

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[Example] 'Particle-PLUS' DC Magnetron Sputter

A case study of the DC magnetron sputtering method using process plasma, known as 'Particle-PLUS'.

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - It excels in plasma analysis within vacuum chambers, enabling high-speed simulations of film deposition rates and more. - It is proficient in plasma simulations in low-pressure gases, where calculations using fluid models are challenging. - It supports 2D and 3D, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitive coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Electron and ion density distribution/temperature distribution/generation distribution - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Neutral gas density distribution/temperature distribution/velocity distribution, etc. *For more details, please feel free to contact us.

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[Example] Particle-PLUS DC Magnetron Sputter 3D

"Particle-PLUS" specializes in plasma analysis within vacuum chambers and can perform simulations of deposition rates at high speeds.

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It specializes in plasma simulations in low-pressure gases, where calculations with fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, efficiently handling complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitive coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

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[Case Study] Plasma Analysis of "Particle-PLUS" Dual Frequency CCP

Introduction to Particle-PLUS Analysis Case: "Plasma Analysis of Dual Frequency CCP" Simulation Case

This is a case study on plasma analysis of CCP (Capacitively Coupled Plasma) devices. Particle-PLUS specializes in plasma analysis within vacuum chambers and can perform high-speed simulations even when multiple electrodes are present or when applying overlapping frequencies. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where calculations using fluid models are challenging. - Supports 2D (two-dimensional) and 3D (three-dimensional) analyses, efficiently handling complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *For more details, please feel free to contact us.

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  • Other analytical equipment

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[Example] Cleaning Process by Particle-PLUS: CCP

Introduction of Particle-PLUS Analysis Case: "Cleaning Process by CCP" Simulation Case

This is an analysis case regarding CCP (Capacitively Coupled Plasma) etching, which is one of the representative dry etching methods. Particle-PLUS specializes in plasma analysis within vacuum chambers and can quickly simulate etching rates and other parameters. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can obtain results quickly without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where fluid modeling is challenging. - Supports both 2D and 3D analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit customer devices is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *For more details, please feel free to contact us.

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  • Other analytical equipment

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Example: Particle-PLUS: GEC-CCP Device Plasma Analysis

Introduction to Particle-PLUS Analysis Case: "Plasma Analysis of GEC-CCP Device" 3D Simulation Case

This is a 3D analysis case related to CCP (Capacitively Coupled Plasma) etching, which is one of the representative dry etching methods. Particle-PLUS specializes in plasma analysis within vacuum chambers and can perform simulations of etching rates and other parameters at high speed. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can obtain results quickly without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where fluid modeling is challenging. - Supports both 2D and 3D, allowing efficient analysis even for complex models. - As a strength of our in-house developed software, customization to fit customer devices is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *Please feel free to contact us for more details.

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  • Other analytical equipment

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[Example] Particle-PLUS: 3D Counter Target Type Patter

Introduction of Particle-PLUS Analysis Case: "Opposing Target Type Patter (3D Analysis)" Simulation Case

This is an analysis case of a counter-target sputtering method, which is one of the film formation techniques that causes low damage to the substrate. 3D calculations have a higher computational cost compared to 2D calculations, but they allow for simulations that take into account more complex shapes and their effects. ◇ Features of 'Particle-PLUS' - Specializes in low-pressure plasma analysis. - By combining axisymmetric models and mirror-symmetric boundary conditions, results can be obtained quickly without the need to simulate the entire device. - Excels in plasma simulations for low-pressure gases, where calculations using fluid models are challenging. - Supports both 2D and 3D, enabling efficient analysis even for complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *Please feel free to contact us for more details.

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[Analysis Case] Magnetron Sputtering Simulation

Simulation of atomic behavior within a magnetron sputtering device using the particle-based plasma analysis software Particle-PLUS.

Particle-PLUS is an excellent simulation software for numerical analysis of non-equilibrium plasma generated in rarefied gases. It can be utilized in applications such as magnetron sputtering, PVD, plasma CVD, capacitively coupled plasma (CCP), and dielectric barrier discharge (DBD). By utilizing the sputter particle module among various modules (refer to the product descriptions below), it is possible to determine the behavior of atoms sputtered from the target in plasma and neutral gas environments in magnetron sputtering devices, allowing for quick evaluation of flux distribution on opposing substrates. The analysis procedure involves using the particle and energy flux of the plasma obtained from the plasma module to determine the generation distribution and amount of sputter particles, and tracking their motion using a particle method known as the test particle method.

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[Example] 'Particle-PLUS' Cylindrical Magnetron Device

An example of "Particle-PLUS" analysis of magnetron sputtering using a cylindrical target, which is one method for forming a strong film on the inside of a long cylinder.

"Particle-PLUS" is a simulation software suitable for the research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations for low-pressure gases, where calculations using fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Electron and ion density distribution/temperature distribution/generation distribution - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

  • Scientific Calculation and Simulation Software
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[Example] Particle-PLUS Opposing Target Sputter

Introduction of analysis examples using "Particle-PLUS": "Opposing Target Sputtering"

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations of low-pressure gases, where calculations using fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing efficient analysis even for complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

  • Scientific Calculation and Simulation Software
  • Other Software
  • Other analytical equipment

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[Example] Particle-PLUS 2 Frequency CCP

Introduction of analysis examples using "Particle-PLUS" Particle-PLUS also allows for the calculation of overlapping two-frequency CCP.

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations for low-pressure gases, where calculations using fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Electron and ion density distribution/temperature distribution/generation distribution - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Neutral gas density distribution/temperature distribution/velocity distribution, etc. *Please feel free to contact us for more details.

  • Scientific Calculation and Simulation Software
  • Other Software
  • Other analytical equipment

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[Example] "Particle-PLUS" Counter Target Sputtering

Introduction of Particle-PLUS Analysis Case: "Simulation Case of Al Thin Film Fabrication Using Face-to-Face Target"

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations for low-pressure gases, where calculations with fluid models are challenging. - It supports both 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *Please feel free to contact us for more details.

  • Scientific Calculation and Simulation Software
  • Other Software
  • Other analytical equipment

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[Example] Mass analysis of the "Particle-PLUS" ion beam.

Introduction to Particle-PLUS Analysis Examples: "Ion Beam Mass Analysis and Electrostatic Acceleration" Simulation Case Study

"Particle-PLUS" is a simulation software suitable for the research, development, and manufacturing of devices and materials using plasma. - It excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, results can be obtained quickly without the need for full device simulations. - It specializes in plasma simulations in low-pressure gases, where calculations with fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitive coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

  • Scientific Calculation and Simulation Software
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  • Other analytical equipment

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